Hybrid implementation service of COB and SMD | Achieving miniaturization and high functionality
Are you having trouble with COB and SMD on separate lines? Optimize costs and processes with consolidated mixed loading! *One-stop support from prototypes.
Are you having trouble with mixed COB and SMD mounting? Our company offers hybrid technology that allows for high-precision mounting of COB (Chip On Board) and SMD (Surface Mount Devices) on the same substrate. In module products that are becoming smaller and more functional, we simultaneously achieve space-saving, high reliability, and thermal design compatibility. We have a proven track record in various industries, including LED modules, sensors, and medical and automotive devices. We can provide one-stop support from design and prototyping to mass production. Please feel free to consult with us! 【Features】 ■ Comprehensive support for COB + SMD mixed mounting ■ Suitable for compact, high-density circuit design ■ Many achievements in LED, sensor, and automotive modules ■ Prototypes and short delivery times are acceptable 【Use Cases and Expected Applications】 ■ Development of compact, high-output LED modules ■ Spatial optimization design on IoT sensor boards ■ Ultra-compact mounting for medical probes and wearable devices *For more details, please refer to the PDF document or feel free to contact us.
- Company：イデアシステム
- Price：Other
